JPH02125338U - - Google Patents

Info

Publication number
JPH02125338U
JPH02125338U JP3351589U JP3351589U JPH02125338U JP H02125338 U JPH02125338 U JP H02125338U JP 3351589 U JP3351589 U JP 3351589U JP 3351589 U JP3351589 U JP 3351589U JP H02125338 U JPH02125338 U JP H02125338U
Authority
JP
Japan
Prior art keywords
discharge nozzle
nozzle
nozzles
intersections
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3351589U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3351589U priority Critical patent/JPH02125338U/ja
Publication of JPH02125338U publication Critical patent/JPH02125338U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP3351589U 1989-03-23 1989-03-23 Pending JPH02125338U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3351589U JPH02125338U (en]) 1989-03-23 1989-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3351589U JPH02125338U (en]) 1989-03-23 1989-03-23

Publications (1)

Publication Number Publication Date
JPH02125338U true JPH02125338U (en]) 1990-10-16

Family

ID=31537232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3351589U Pending JPH02125338U (en]) 1989-03-23 1989-03-23

Country Status (1)

Country Link
JP (1) JPH02125338U (en])

Similar Documents

Publication Publication Date Title
JPH02125338U (en])
JPS62183582U (en])
JPH0311444U (en])
JPS60159081U (ja) 温水洗浄トイレの噴水ノズル
JPH0184773U (en])
JPH02131552U (en])
JPH033400U (en])
JPS6370177U (en])
JPS6024331U (ja) スプレイ塔
JPS5989655U (ja) 塗型装置
JPS5915460U (ja) 大流量散水ヘツド
JPS62104899U (en])
JPS61115163U (en])
JPS6275000U (en])
JPS63122750U (en])
JPS6177052U (en])
JPH0457084U (en])
JPH0318588U (en])
JPH0347648U (en])
JPH0266285U (en])
JPH02114167U (en])
JPH01106720U (en])
JPH037953U (en])
JPH0319550U (en])
JPH0358629U (en])